CPU companion heat balm, thermal conductivity: 4W/mk, 6W/mk,
8.5W/mk; High thermal conductivity, insulation and high temperature
resistance
High-temperature resistance without curing
Ant Xin CPU companion heat sink has good high and low-temperature
resistance (temperature range -60?~200?) and has the characteristics of
non-solid and non-powdered silica gel, good thermal conductivity
It completes the heat transfer of various uneven gaps and makes up
for the thermal conductive silicone sheet and insufficient thermal
grease
Strong thermal conductivity, good insulatageingaging resistance,
rapid reduction of CPU, and so on Temperature of thermal components
High thermal conductivity, low thermal resistance, good
wettability, soft, stress-free and can be compressed to as thin as
0.1mm, can fill any uneven gap, no settlement, no flow, no oil, safe
non-conducting